From NDCD die to high-cooling technology: Vassena’s latest innovations
Vassena Filiere, an Italy-based wire die manufacturer, continuously enhances its technologies to improve industrial processes in the wire sector. The company’s latest innovations include the high-cooling and the nano-diamond-coated dies, now also available in a multilayer-coated version. 3D-printed high-cooling wire drawing diesVassena’s 3D-printed stainless steel die is designed to optimize cooling during the wire drawing process. Thanks to an internal perforated coil, water flows through the die, ensuring uniform and rapid cooling. Nano-diamond coated dies, now also multilayerVassena’s latest innovation is a multilayer nano-diamond coated die, designed for drawing high-carbon steel wire—a process previously considered impractical. This breakthrough was achieved through extensive research and development in collaboration with universities. Thanks to this synergy, the coating has been optimized to ensure high performance and greater processing efficiency. The future of wire drawing3D high-cooling dies and multilayer nano-diamond coated dies represent the pinnacle of innovation in the industry. The former ensures superior performance and efficiency thanks to optimized cooling, while the latter enables the drawing of high-carbon steel wire, reducing tool wear. Together, these technologies provide an advanced solution for optimizing production and represent the future of the wire industry—an ideal choice for companies striving for maximum competitiveness.
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